Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming

Strusevich, Nadezhda; Desmulliez, Marc P.Y.; Abraham, Eitan; Flynn, David; Jones, Thomas; Patel, Mayur; Bailey, Christopher (2013)
Springer Berlin Heidelberg
English
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This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

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