This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.
Greenwich Academic Literature Archive (http://gala.gre.ac.uk/10389/1/10389_STRUSEVICH_PATEL_BAILEY__AdvManuf_V2-UoG-Heriot-Watt-Paper-Revisions_%282013%29_%28AAM%29.pdf)
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