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Strusevich, Nadezhda; Desmulliez, Marc P.Y.; Abraham, Eitan; Flynn, David; Jones, Thomas; Patel, Mayur; Bailey, Christopher (2013)
Publisher: Springer Berlin Heidelberg
Languages: English
Types: Article
Subjects: QA
This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.
  • The results below are discovered through our pilot algorithms. Let us know how we are doing!

    • [1] Strusevich N, Bailey C, Costello S, Patel M, Desmulliez MPY (2013) Numerical modeling of electroplating process for microvia fabrication. In: EuroSimE conference, Wroclaw, Poland, April 2013.
    • [2] Andricacos PC, Uzoh C, Dukovic JO, Horcans J, Deligianni H (1998) Damascene copper electroplating for chip interconnects. IBM J Res Dev 42(5):567−574
    • [3] Moffat TP,. Wheeler D, Kim S-K Josell D (2006) Curvature enhanced adsorbate coverage model for electrodeposition. JES 153(2):C127−C132
    • [4] Frampton KD, Martin SE, Minor K (2003) The scaling of acoustic streaming for application in micro-fluidic devices. Appl Ac 64:681−692
    • [5] Kirby BJ (2010) Micro- and nanoscale fluid mechanics: Transport in microfluidic devices. Cambridge University Press, Cambridge
    • [6] Low CTJ, Roberts EPL, Walsh FC (2007) Numerical simulation of the current, potential and concentration distributions along the cathode of a rotating cylinder hull cell. Electrochem Acta 52:3831−3840
    • [7] Wheeler D, Josell D, Moffat TP (2003) Modeling superconformal electrodeposition using the level set method. JES 150(5):C302−C310
    • [8] PHYSICA, Multiphysics Software Ltd, London, 2000, http://www.multi-physics.com
    • [9] Fang C (2011) Croissance electrolytique du cuivre appliquii a la technologie system in package. PhD thesis. University of Rennes, France
    • [10] Lord Rayleigh (1945) The Theory of Sound. Dover, New York
    • [11] Nyborg WLM (1965) Acoustic streaming. In: Physical Acoustics, Principles and methods. Academic Press, New York and London 2B:265−331
    • [12] Gale GW, Busnaina AA (1999) Roles of cavitation and acoustic streaming in megasonic cleaning. Particulate Science and Technology 17:229−238
    • [13] Nilson RH, Griffiths SK (2002) Enhanced transport by acoustic streaming in deep trenchlike cavities. JES 149(4):G286−G296
    • [14] Liu G, Huang X, Xiong Y Tian Y (2008) Fabrication HARMS by using megasonic assisted electroforming. Microsyst Technol 14:1223−122
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