Remember Me
Or use your Academic/Social account:


Or use your Academic/Social account:


You have just completed your registration at OpenAire.

Before you can login to the site, you will need to activate your account. An e-mail will be sent to you with the proper instructions.


Please note that this site is currently undergoing Beta testing.
Any new content you create is not guaranteed to be present to the final version of the site upon release.

Thank you for your patience,
OpenAire Dev Team.

Close This Message


Verify Password:
Verify E-mail:
*All Fields Are Required.
Please Verify You Are Human:
fbtwitterlinkedinvimeoflicker grey 14rssslideshare1
Strusevich, Nadezhda; Desmulliez, Marc P.Y.; Abraham, Eitan; Flynn, David; Jones, Thomas; Patel, Mayur; Bailey, Christopher (2013)
Publisher: Springer Berlin Heidelberg
Languages: English
Types: Article
Subjects: QA
This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via’s), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.
  • The results below are discovered through our pilot algorithms. Let us know how we are doing!

    • [1] Strusevich N, Bailey C, Costello S, Patel M, Desmulliez MPY (2013) Numerical modeling of electroplating process for microvia fabrication. In: EuroSimE conference, Wroclaw, Poland, April 2013.
    • [2] Andricacos PC, Uzoh C, Dukovic JO, Horcans J, Deligianni H (1998) Damascene copper electroplating for chip interconnects. IBM J Res Dev 42(5):567−574
    • [3] Moffat TP,. Wheeler D, Kim S-K Josell D (2006) Curvature enhanced adsorbate coverage model for electrodeposition. JES 153(2):C127−C132
    • [4] Frampton KD, Martin SE, Minor K (2003) The scaling of acoustic streaming for application in micro-fluidic devices. Appl Ac 64:681−692
    • [5] Kirby BJ (2010) Micro- and nanoscale fluid mechanics: Transport in microfluidic devices. Cambridge University Press, Cambridge
    • [6] Low CTJ, Roberts EPL, Walsh FC (2007) Numerical simulation of the current, potential and concentration distributions along the cathode of a rotating cylinder hull cell. Electrochem Acta 52:3831−3840
    • [7] Wheeler D, Josell D, Moffat TP (2003) Modeling superconformal electrodeposition using the level set method. JES 150(5):C302−C310
    • [8] PHYSICA, Multiphysics Software Ltd, London, 2000, http://www.multi-physics.com
    • [9] Fang C (2011) Croissance electrolytique du cuivre appliquii a la technologie system in package. PhD thesis. University of Rennes, France
    • [10] Lord Rayleigh (1945) The Theory of Sound. Dover, New York
    • [11] Nyborg WLM (1965) Acoustic streaming. In: Physical Acoustics, Principles and methods. Academic Press, New York and London 2B:265−331
    • [12] Gale GW, Busnaina AA (1999) Roles of cavitation and acoustic streaming in megasonic cleaning. Particulate Science and Technology 17:229−238
    • [13] Nilson RH, Griffiths SK (2002) Enhanced transport by acoustic streaming in deep trenchlike cavities. JES 149(4):G286−G296
    • [14] Liu G, Huang X, Xiong Y Tian Y (2008) Fabrication HARMS by using megasonic assisted electroforming. Microsyst Technol 14:1223−122
  • No related research data.
  • Discovered through pilot similarity algorithms. Send us your feedback.

Share - Bookmark

Cite this article