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Čekon, Miroslav; Struhala, Karel; Slávik, Richard (2017)
Publisher: Scrivener Publishing
Languages: English
Types: Article
Subjects: Cardboard, Thermal insulation, Thermal performance, Environmental impacts, Life-Cycle Assessment, Packaging industry
Cardboard based packaging components represent a material with a significant potential of renewable exploitation in buildings. This study presents the results of thermal and environmental analysis of existing packaging materials compared with standard conventional thermal insulations. Experimental measurements were performed to identify the thermal performance of studied cardboard packaging materials. Real-size samples were experimentally tested in laboratory measurements. The thermal resistance and conductivity of all the analysed samples were measured according to the procedure indicated in the ISO8032 standard. A Life-Cycle Assessment according to ISO 14040 was also performed to evaluate the environmental impacts related with the production of these materials. The results show that cardboard panels are a material with thermal and environmental properties on par with contemporary thermal insulations. Depending on their structure the measured thermal conductivity varies from 0.05 to 0.12 W·m-1·K-1 and their environmental impacts are much lower than those of polyisocyanurate foam or mineral wool. Cardboard based packaging components represent a material with a significant potential of renewable exploitation in buildings. This study presents the results of thermal and environmental analysis of existing packaging materials compared with standard conventional thermal insulations. Experimental measurements were performed to identify the thermal performance of studied cardboard packaging materials. Real-size samples were experimentally tested in laboratory measurements. The thermal resistance and conductivity of all the analysed samples were measured according to the procedure indicated in the ISO8032 standard. A Life-Cycle Assessment according to ISO 14040 was also performed to evaluate the environmental impacts related with the production of these materials. The results show that cardboard panels are a material with thermal and environmental properties on par with contemporary thermal insulations. Depending on their structure the measured thermal conductivity varies from 0.05 to 0.12 W·m-1·K-1 and their environmental impacts are much lower than those of polyisocyanurate foam or mineral wool.
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